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德州仪器TM4C123G用户手册编程手册英文版免费下载
部分目录或截图为：
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Tiva™ CSeriesTM4C123GLaunchPad
EvaluationBoard
User'sGuide
1 Board Overview ............................................................
1.1 Kit Contents ............................................................
1.2 Using the Tiva C Series LaunchPad ...............................
1.3 Features ................................................................
1.4 BoosterPacks ..........................................................
1.5 Specifications ..........................................................
2 Hardware Description ....................................................
2.1 Functional Description ................................................
2.1.1 Microcontroller ................................................
2.1.2 USB Connectivity ............................................
2.1.3 Motion Control ................................................
2.1.4 User Switches and RGB User LED ........................
2.1.5 Headers and BoosterPacks .................................
2.2 Power Management ...................................................
2.2.1 Power Supplies ...............................................
2.2.2 Hibernate ......................................................
2.2.3 Clocking ........................................................
2.2.4 Reset ...........................................................
2.3 In-Circuit Debug Interface (ICDI) ....................................
2.3.1 Virtual COM Port .............................................
3 Software Development ...................................................
3.1 Software Description ..................................................
3.2 Source Code ...........................................................
3.3 Tool Options ............................................................
3.4 Programming the Tiva C Series LaunchPad Evaluation Board .
4 References, PCB Layout, and Bill of Materials ..................
4.1 References .............................................................
4.2 Component Locations .................................................
4.3 Bill of Materials (BOM) ................................................
A Schematics ...................................................................
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